Low Temperature Solder
Low Temperature Solder
<Feature>
・The melting point temperature is less than 183℃.
・Solder wire, up to φ0.2mm, available with Bi-Sn alloy.
・In-Sn alloy has characteristics of relatively soft and superior stress relief.
・It is suitable for the soldering process of heat-sensitive materials, energy-saving, seal materials, thermal sensors, and fusing materials.
Low Temperature Solder Properties
Alloy Number |
736 |
048 |
131 |
760 |
| Composition | BiSnAg | InSn | InAg | InSnAgX |
| Solid-Liquid ℃ | 139-140 | 119-119 | 143-143 | 145-148 |
| Specific Gravity | 8.6 | 7.3 | 7.4 | 7.4 |
| Hardness (Hv) | 16.6 | 4.3 | 1.6 | 2.5 |
| Specific Resistance (µΩcm) | 36.6 | 18.0 | 8.5 | 9.3 |
| Feature | 139℃
Bi Hard | 119℃
Soft | 143℃
Soft Low resistance | 145℃
Higher Bonding strength Low resistance |
Low Temperature Solder example
Shape example |
736 |
048 |
131 |
760 |
| Solder wire (mm) | φ0.7, 0.4, 0.3, 0.2 | φ1.0, 0.5, 0.32 | φ1.0, 0.5 | Φ2.0, 1.6 |
| Solder Tape (mm) | T0.08×W0.4
T0.2×W1.4 | T0.13×W0.6
T0.08×W23 | T0.4×W0.6
T0.4×W4.0 | T0.4×W4.0
T0.4×W6.0 |
・Feel free to consult us about new compositions and small Qty for development/evaluation purposes.
